Title:
ADHESIVE COMPOSITION, ADHESIVE SHEET, LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/106848
Kind Code:
A1
Abstract:
[Problem] To provide an adhesive composition which has a high adhesion to a metal substrate and a resin substrate such as a liquid crystal polymer or syndiotactic polystyrene as well as to a conventional polyimide or polyester film, and also has excellent low dielectric characteristics and pot life, and from which high solder heat resistance can be achieved. [Solution] This adhesive composition contains (a) an acid-modified polyolefin, (b) a phenol resin having a polycyclic structure, and (c) an epoxy resin.
Inventors:
SONODA RYO (JP)
KAWAKUSU TETSUO (JP)
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2020/043610
Publication Date:
June 03, 2021
Filing Date:
November 24, 2020
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/32; B32B27/38; B32B27/42; C08F8/46; C08G59/62; C09J7/30; C09J9/00; C09J11/06; C09J123/26; C09J161/02; C09J163/00
Foreign References:
| JP2007112848A | 2007-05-10 | |||
| JP2017039842A | 2017-02-23 | |||
| JP2003171530A | 2003-06-20 | |||
| JP2007001291A | 2007-01-11 | |||
| JP2019089965A | 2019-06-13 | |||
| JP2019089966A | 2019-06-13 | |||
| JP2019089967A | 2019-06-13 | |||
| JP2002053730A | 2002-02-19 |
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