Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE COMPOSITION, ADHESIVE SHEET, AND SEALED BODY
Document Type and Number:
WIPO Patent Application WO/2018/221573
Kind Code:
A1
Abstract:
Provided is an adhesive composition containing: component (A) a modified polyolefin resin and component (B) a polyfunctional epoxy compound which is a liquid at 25°C, and optionally containing component (C) a polyfunctional epoxy compound which is a solid at 25°C. The total quantity of component (B) and component (C) is more than 100 parts by mass with respect to 100 parts by mass of component (A). Also provided are an adhesive sheet having an adhesive layer formed using this adhesive composition, and a sealed body obtained by sealing an object to be sealed with this adhesive sheet. According to the present invention it is possible to provide an adhesive composition which can be formed easily into sheet form, an adhesive sheet having an adhesive layer with outstanding tracking of recesses and protrusions, and which is formed using this adhesive composition, and a sealed body obtained by sealing an object to be sealed with the adhesive sheet.

Inventors:
NISHIJIMA KENTA (JP)
HASEGAWA TATSUKI (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2018/020733
Publication Date:
December 06, 2018
Filing Date:
May 30, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LINTEC CORP (JP)
International Classes:
C09J163/00; C09J7/00; C09J11/06; C09J123/26; G09F9/30; H01L27/32; H01L51/50; H05B33/04
Domestic Patent References:
WO2018047919A12018-03-15
WO2018047868A12018-03-15
Foreign References:
JP2008163344A2008-07-17
JPS6361017A1988-03-17
JPH04142383A1992-05-15
JPS5925835A1984-02-09
JP2001240838A2001-09-04
JP2005260204A2005-09-22
JP2000007840A2000-01-11
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ADHESIVE COMPOSITION, ADHESIVE SHEET, AND SEALED BODY

Next Patent: ADHESIVE COMPOSITION, ADHESIVE SHEET AND SEALED BODY