Title:
ADHESIVE COMPOSITION, ADHESIVE SHEET AND SEALED BODY
Document Type and Number:
WIPO Patent Application WO/2018/221574
Kind Code:
A1
Abstract:
Provided is an adhesive composition containing: component (A) a modified polyolefin resin; component (B) a polyfunctional epoxy compound which is a liquid at 25°C; and component (C) a polyfunctional epoxy compound which is a solid at 25°C. When the volatile components contained in the adhesive composition are analyzed using the purge and trap method, the amount of volatile antioxidants contained does not exceed 0.2 mg/cm3 in terms of toluene. Also provided are an adhesive sheet having an adhesive layer formed using this adhesive composition, and a sealed body obtained by sealing an object to be sealed with the adhesive sheet. According to the present invention it is possible to provide an adhesive composition which can be easily formed into sheets, and which, when used as a sealant, renders electrode members, organic semiconductors and the like resistant to corrosion, an adhesive sheet having an adhesive layer which hinders corrosion of electrode members and organic semiconductors and is formed using this adhesive composition, and a sealed body obtained by sealing an object to be sealed with the adhesive sheet.
More Like This:
Inventors:
NISHIJIMA KENTA (JP)
HASEGAWA TATSUKI (JP)
KASHIO MIKIHIRO (JP)
HASEGAWA TATSUKI (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2018/020734
Publication Date:
December 06, 2018
Filing Date:
May 30, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J123/26; C09J7/00; C09J11/06; C09J163/00; G09F9/30; H01L27/32; H01L51/50; H05B33/04
Domestic Patent References:
| WO2018047919A1 | 2018-03-15 | |||
| WO2018047868A1 | 2018-03-15 |
Foreign References:
| JP2008163344A | 2008-07-17 | |||
| JPS6361017A | 1988-03-17 | |||
| JP2016125042A | 2016-07-11 | |||
| JP2001240838A | 2001-09-04 | |||
| JP2005260204A | 2005-09-22 | |||
| JP2000007840A | 2000-01-11 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
Download PDF: