Title:
ADHESIVE COMPOSITION AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2020/116101
Kind Code:
A1
Abstract:
Provided is an adhesive composition that includes a hydroxy-group-containing (meth)acrylic resin (a), a hydroxy-group-containing modified unsaturated epoxy ester resin (b), a polyisocyanate compound (c), and a photopolymerization initiator (d). The hydroxy-group-containing modified unsaturated epoxy ester resin (b) has: ethylenic unsaturated groups that are bonded, via an oxy group, to secondary carbon atoms that derive from epoxy groups; and α,β-unsaturated monobasic acid groups that are bonded to primary carbon atoms that derive from epoxy groups. The ester resin (b) has or does not have epoxy groups, and the number of α,β-unsaturated monobasic acid groups is at least the number of epoxy groups. The polyisocyanate compound (c) is a polyisocyanate that is derived from an aliphatic diisocyanate.
Inventors:
SASAKI KAZUHIRO (JP)
NAODA KOJI (JP)
IKEYA TATSUHIRO (JP)
NAKANISHI KENICHI (JP)
NAODA KOJI (JP)
IKEYA TATSUHIRO (JP)
NAKANISHI KENICHI (JP)
Application Number:
PCT/JP2019/044372
Publication Date:
June 11, 2020
Filing Date:
November 12, 2019
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C09J133/14; C09J7/38; C09J163/10; C09J175/04; C09J163/02
Foreign References:
| JP2015147898A | 2015-08-20 | |||
| JP2015174935A | 2015-10-05 | |||
| JP2013040323A | 2013-02-28 | |||
| JP2019019150A | 2019-02-07 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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