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Title:
ADHESIVE COMPOSITION AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/085009
Kind Code:
A1
Abstract:
An adhesive composition comprising the following (A) and (B) ingredients, and an adhesive sheet comprising an adhesive layer formed from this adhesive composition. This adhesive composition gives cured objects having low-dielectric properties in a high-frequency region and excellent adhesion strength. Ingredient (A): A modified polyolefin resin Ingredient (B): A compound having a poly(phenylene ether) skeleton and a crosslinkable functional group

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Inventors:
NISHIJIMA KENTA (JP)
YAMASAKI TOSHIYA (JP)
Application Number:
PCT/JP2020/036883
Publication Date:
May 06, 2021
Filing Date:
September 29, 2020
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J11/06; C09J7/30; C09J123/26; C09J171/12
Domestic Patent References:
WO2019230445A12019-12-05
Foreign References:
US20160137890A12016-05-19
US20130180770A12013-07-18
US20180022976A12018-01-25
JP2019504124A2019-02-14
US20150351237A12015-12-03
JP2020029557A2020-02-27
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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