Title:
ADHESIVE SHEET FOR DEVICES
Document Type and Number:
WIPO Patent Application WO/2021/085008
Kind Code:
A1
Abstract:
Provided is an adhesive sheet for devices, having a curable adhesive layer comprising component (A) and component (B), and having a component (A) content of at least 3.0 mass% in the curable adhesive layer. The adhesive sheet for devices provides a cured product having low dielectric properties in a high frequency region, and has a curable adhesive layer exhibiting an excellent adhesive suitability. Component (A): A nonaromatic curable compound that is a liquid at 25°C
Component (B): A modified polyphenylene ether resin
Inventors:
NISHIJIMA KENTA (JP)
Application Number:
PCT/JP2020/036882
Publication Date:
May 06, 2021
Filing Date:
September 29, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/35; C09J4/00; C09J11/06; C09J163/00; C09J171/12; C09J201/00
Domestic Patent References:
| WO2016147984A1 | 2016-09-22 | |||
| WO2018179682A1 | 2018-10-04 |
Foreign References:
| JPH05309785A | 1993-11-22 | |||
| JP2001342450A | 2001-12-14 | |||
| JP2019023263A | 2019-02-14 | |||
| JP2017014475A | 2017-01-19 | |||
| JP2015086330A | 2015-05-07 | |||
| JP2020002217A | 2020-01-09 | |||
| JP2020172588A | 2020-10-22 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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