Title:
ADHESIVE COMPOSITION, ADHESIVE TAPE, AND ELECTRONIC COMPONENT PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/225163
Kind Code:
A1
Abstract:
An objective of the present invention is to provide an adhesive composition that enables an adherend to be easily removed even after having spent an extended length of time at 250°C or higher, or having undergone a high-temperature machining process at a temperature of 300°C or higher in a state of being anchored. Another objective of the present invention is to provide an adhesive tape that includes an adhesive layer comprising the adhesive composition, and an electronic component processing method that uses said adhesive tape. The adhesive composition according to the present invention contains a silicone-modified polyimide (A) and a curable resin (B) having a double bond.
Inventors:
SHICHIRI TOKUSHIGE (JP)
TAKAHASHI TOSHIO (JP)
TAKAHASHI TOSHIO (JP)
Application Number:
PCT/JP2021/017523
Publication Date:
November 11, 2021
Filing Date:
May 07, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J4/00; C09J7/38; C09J179/08; C09J183/00; C09J201/02; H01L21/683
Domestic Patent References:
| WO2018237377A1 | 2018-12-27 |
Foreign References:
| JP2014029999A | 2014-02-13 | |||
| JP2003133358A | 2003-05-09 | |||
| JP2011042729A | 2011-03-03 | |||
| JP2003327925A | 2003-11-19 | |||
| JP2010270293A | 2010-12-02 | |||
| JP2009074067A | 2009-04-09 | |||
| JP2006104447A | 2006-04-20 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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