Title:
TRANSFER FILM, METHOD FOR PRODUCING LAMINATE, TOUCH SENSOR, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/225162
Kind Code:
A1
Abstract:
The present invention provides: a transfer film capable of suppressing conductive wire formation failures when used in the formation of narrow conductive wire; a method for producing a laminate; a method for producing a printed circuit board; and a touch sensor. The transfer film of the present invention has a temporary support body and a photosensitive composition layer positioned on the temporary support body, and the number of foreign objects in the photosensitive composition layer which have a diameter of at least 1μm is no more than 10/mm2.
Inventors:
ONITSUKA HISASHI (JP)
Application Number:
PCT/JP2021/017507
Publication Date:
November 11, 2021
Filing Date:
May 07, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/09; G03F7/40; G06F3/041; G06F3/044; H05K3/06
Domestic Patent References:
| WO2016072202A1 | 2016-05-12 | |||
| WO2019151534A1 | 2019-08-08 |
Foreign References:
| JP2019031597A | 2019-02-28 | |||
| JP2013238837A | 2013-11-28 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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