Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/033076
Kind Code:
A1
Abstract:
Provided is an adhesive composition having both a high adhesion strength and an improved cohesive failure rate. The adhesive composition comprises a heat-curable resin [referred to as component (A)], thermoplastic-resin particles [referred to as component (B)], and a hardener and/or a hardening accelerator [inclusively referred to as component (C); the hardener is referred to as component (C-1) and the hardening accelerator as component (C-2)], wherein the component (B) is thermoplastic-resin particles which, when examined as a no. 7 dumbbell specimen having a width of 2 mm and a thickness of 1 mm formed in accordance with JIS K7161, have a tensile modulus of 1 GPa or less and which have a strain energy per unit volume, as obtained from a stress-strain curve of the specimen, of 20,000 kJ/m3 or greater.
Inventors:
KAKUTAKA KAIRI (JP)
Application Number:
PCT/JP2022/032856
Publication Date:
March 09, 2023
Filing Date:
August 31, 2022
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C09J201/00; C09J11/08; C09J163/00
Domestic Patent References:
| WO2015093281A1 | 2015-06-25 | |||
| WO2020235588A1 | 2020-11-26 |
Foreign References:
| JPH09241602A | 1997-09-16 | |||
| JPS5682865A | 1981-07-06 | |||
| JPH06313157A | 1994-11-08 | |||
| JPS6140371A | 1986-02-26 | |||
| JP2002105283A | 2002-04-10 | |||
| JPH09286969A | 1997-11-04 |
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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