Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/157838
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an epoxy-based adhesive which exhibits good toughness while exhibiting excellent adhesion to a substrate and which also exhibits heat resistance. This adhesive composition can be advantageously used as an adhesive that exhibits excellent adhesive properties, toughness, heat resistance, etc., and is therefore expected to contribute greatly to the industrial world in the technical field of structural adhesives in particular. This adhesive composition contains an epoxy resin (A), a curing agent (B), a curing catalyst (C), a thixotropic agent (D) and a crystalline polyester (E).
Inventors:
SHIBA TAKUYA (JP)
Application Number:
PCT/JP2023/004994
Publication Date:
August 24, 2023
Filing Date:
February 14, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J163/00; C09J11/08
Foreign References:
| JP2012519220A | 2012-08-23 | |||
| JP2015012069A | 2015-01-19 | |||
| JPS5344199B2 | 1978-11-27 | |||
| JP2021095531A | 2021-06-24 | |||
| JP2016199739A | 2016-12-01 | |||
| JPS53114844A | 1978-10-06 |
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