Title:
ADHESIVE, AND DIE ATTACH FILM AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/103323
Kind Code:
A1
Abstract:
The embodiments of the invention disclose an adhesive, and a die attach film and a preparation method therefor. The adhesive comprises, in parts by mass, 20-60 parts of an epoxy resin, 20-30 parts of a phenoxy resin, 5-10 parts of an indene oligomer, 15-30 parts of a filler, and 1-5 parts of a curing agent.
Inventors:
WU DE (CN)
LIAO SHUHANG (CN)
LI TING (CN)
WANG YI (CN)
SU JUNXING (CN)
LIAO SHUHANG (CN)
LI TING (CN)
WANG YI (CN)
SU JUNXING (CN)
Application Number:
PCT/CN2022/099180
Publication Date:
June 15, 2023
Filing Date:
June 16, 2022
Export Citation:
Assignee:
WUHAN CHOICE TECH CO LTD (CN)
International Classes:
C09J7/10; C08L63/00; C09J11/04; C09J11/06; C09J163/02; C09J171/12; H01L23/29
Foreign References:
| CN113897163A | 2022-01-07 | |||
| CN112778937A | 2021-05-11 | |||
| CN111315820A | 2020-06-19 | |||
| CN102559113A | 2012-07-11 | |||
| JP2007063306A | 2007-03-15 | |||
| JPH10265650A | 1998-10-06 | |||
| JP2001214147A | 2001-08-07 | |||
| CN103665762A | 2014-03-26 | |||
| CN1267696A | 2000-09-27 |
Other References:
LI JIN-WEI: "New Electronic Electrical Insulation Encapsulation Epoxy Resin Material", CHEMICAL INDUSTRY., vol. 33, no. 11, 21 November 2015 (2015-11-21), pages 12 - 14, XP093072159
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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