Title:
ADHESIVE, DIE BOND MATERIAL COMPRISING ADHESIVE, CONDUCTIVE CONNECTION METHOD USING ADHESIVE, AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED USING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/092742
Kind Code:
A1
Abstract:
The present invention pertains to an adhesive containing: (A) a curable resin composition containing one or more types selected from a silicone resin, a modified silicone resin, an epoxy resin, and a modified epoxy resin; and (B) conductive particles having an average particle diameter of 1μm or less. Therein, the (B) component content is more than 0 vol% and less than 0.1 vol% relative to the solid content of the (A) component, the total light transmittance of a cured article obtained by curing the adhesive and having a thickness of 2mm is 70% or higher, and the haze value thereof is 60% or lower. As a result, the provided adhesive achieves a cured article having high transparency, exhibiting excellent adhesive strength and workability, and having heat resistance and light resistance.
Inventors:
ONAI SATOSHI (JP)
OZAI TOSHIYUKI (JP)
OZAI TOSHIYUKI (JP)
Application Number:
PCT/JP2015/005576
Publication Date:
June 16, 2016
Filing Date:
November 09, 2015
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09J183/04; C09J9/02; C09J163/00; H01L21/52; H01L33/62
Domestic Patent References:
| WO2009022574A1 | 2009-02-19 |
Foreign References:
| KR20130092283A | 2013-08-20 | |||
| JP2009242508A | 2009-10-22 | |||
| JP2006335926A | 2006-12-14 | |||
| JP2004091703A | 2004-03-25 | |||
| JP2007162019A | 2007-06-28 | |||
| JP2003045235A | 2003-02-14 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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