Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CIRCUIT CONNECTED STRUCTURE, AND ADHESIVE FILM HOUSING SET
Document Type and Number:
WIPO Patent Application WO/2020/184585
Kind Code:
A1
Abstract:
One aspect of the present invention is an adhesive film for circuit connection, provided with: a first adhesive layer containing conductive particles and a second adhesive layer disposed on the first adhesive layer, wherein the shortest distance from the surface on the first adhesive layer side of the adhesive film to the surface of the conductive particles is greater than 0 µm but 1 µm or less; the ratio of the thickness of the first adhesive layer to the average particle diameter of the conductive particles is 10 to 80%; and the ratio of the thickness of the second adhesive layer to the total thickness of the first adhesive layer and the second adhesive layer is less than 96%.
Inventors:
ITO AKIHIRO (JP)
OTO YUMIKO (JP)
KUDO SUNAO (JP)
OTO YUMIKO (JP)
KUDO SUNAO (JP)
Application Number:
PCT/JP2020/010388
Publication Date:
September 17, 2020
Filing Date:
March 10, 2020
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J4/00; C09J7/30; C09J9/02; C09J11/04; C09J201/00; H01R11/01; H05K3/36
Domestic Patent References:
| WO2014021457A1 | 2014-02-06 | |||
| WO2007125993A1 | 2007-11-08 |
Foreign References:
| JP2016033021A | 2016-03-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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