Title:
CIRCUIT-CONNECTING ADHESIVE FILM AND METHOD FOR MANUFACTURING SAME, CIRCUIT-CONNECTING STRUCTURE MANUFACTURING METHOD, AND ADHESIVE FILM HOUSING SET
Document Type and Number:
WIPO Patent Application WO/2020/184584
Kind Code:
A1
Abstract:
A circuit-connecting adhesive film 1 comprising a first adhesive layer 2 and a second adhesive layer 3 layered upon the first adhesive layer 2, wherein the first adhesive layer 2 is formed from a cured product of a photosetting composition, the second adhesive layer 3 is formed from a thermosetting composition, the photosetting composition contains a polymerizable compound, a photoinitiator having an oxime ester structure, and conductive particles 4, and the photoinitiator content is 0.3-1.2 mass% in terms of the total amount of the components other than the conductive particles in the photosetting composition.
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Inventors:
OTO YUMIKO (JP)
KUDO SUNAO (JP)
ITO AKIHIRO (JP)
KUDO SUNAO (JP)
ITO AKIHIRO (JP)
Application Number:
PCT/JP2020/010387
Publication Date:
September 17, 2020
Filing Date:
March 10, 2020
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J4/00; C09J7/30; C09J9/02; C09J201/00; H01B1/22; H01B5/16; H01B13/00; H01R11/01; H01R43/00
Domestic Patent References:
| WO2014021457A1 | 2014-02-06 | |||
| WO2019050006A1 | 2019-03-14 |
Foreign References:
| JP2005144745A | 2005-06-09 | |||
| JP2014210878A | 2014-11-13 | |||
| JP2018119103A | 2018-08-02 | |||
| JP2017171472A | 2017-09-28 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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