Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/034464
Kind Code:
A1
Abstract:
Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection comprises: a first adhesive layer containing conductive particles and a thermoplastic resin; and a second adhesive layer provided on the first adhesive layer. The thermoplastic resin includes a resin in which at least some of hydroxy groups in a phenoxy resin are modified with a group represented by formula (1) or formula (1A). [In formula (1), R1 represents a hydrogen atom or a methyl group, x represents an integer of 2-6, and y represents an integer of 1-6. * represents a bonding position that is bonded to an oxygen atom derived from a hydroxy group.] [In formula (1A), R1, x, y, and * have the same meanings as above. *1 and *2 each represent a bonding position that is bonded to a carbon atom of another radically polymerizable group.]
More Like This:
Inventors:
ICHIMURA TAKAYUKI (JP)
NAKAZAWA TAKASHI (JP)
NARITOMI KAZUYA (JP)
NAKAZAWA TAKASHI (JP)
NARITOMI KAZUYA (JP)
Application Number:
PCT/JP2023/028126
Publication Date:
February 15, 2024
Filing Date:
August 01, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J7/30; C09J9/02; C09J11/06; C09J163/00; C09J171/10; H01R11/01
Domestic Patent References:
| WO2020184636A1 | 2020-09-17 |
Foreign References:
| JPH11238538A | 1999-08-31 | |||
| JP2013093245A | 2013-05-16 | |||
| JP2014043574A | 2014-03-13 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: