Title:
ADHESIVE FILM FOR CIRCUIT CONNECTIONS AND MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE FILM HOUSING SET
Document Type and Number:
WIPO Patent Application WO/2019/050011
Kind Code:
A1
Abstract:
This adhesive film 1 for circuit connections is provided with a first adhesive layer 2 containing conductive particles 4, and a second adhesive layer 3 laminated on said first adhesive layer 2, wherein the ratio of the melt viscosity of the first adhesive layer 2 at the temperature at which the second adhesive layer 3 exhibits the lowest melt viscosity, to said lowest melt viscosity of the second adhesive layer 3 is greater than or equal to 10.
Inventors:
MORIJIRI TOMOKI (JP)
OTO YUMIKO (JP)
KUDOU SUNAO (JP)
OTO YUMIKO (JP)
KUDOU SUNAO (JP)
Application Number:
PCT/JP2018/033287
Publication Date:
March 14, 2019
Filing Date:
September 07, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J7/35; C09J4/00; C09J9/02; C09J11/04; C09J11/06; H01B1/20; H01L21/60
Domestic Patent References:
| WO2013024873A1 | 2013-02-21 | |||
| WO2012091061A1 | 2012-07-05 |
Foreign References:
| JP2014043574A | 2014-03-13 | |||
| JP2011192651A | 2011-09-29 | |||
| JP2009170898A | 2009-07-30 | |||
| JP2010123418A | 2010-06-03 | |||
| JP2010199087A | 2010-09-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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