Title:
ADHESIVE FILM FOR CIRCUIT CONNECTIONS AND MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE FILM HOUSING SET
Document Type and Number:
WIPO Patent Application WO/2019/050012
Kind Code:
A1
Abstract:
This adhesive film 1 for circuit connections is provided with a first adhesive layer 2 containing conductive particles 4, and a second adhesive layer 3 laminated on said first adhesive layer 2, wherein the ratio of the DSC calorific value of the first adhesive layer 2 to the DSC calorific value of the second adhesive layer 3 is less than or equal to 0.4.
Inventors:
MORIJIRI TOMOKI (JP)
OTO YUMIKO (JP)
KUDOU SUNAO (JP)
OTO YUMIKO (JP)
KUDOU SUNAO (JP)
Application Number:
PCT/JP2018/033290
Publication Date:
March 14, 2019
Filing Date:
September 07, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J7/35; C09J4/00; C09J9/02; C09J11/04; C09J11/06; H01B1/20; H01L21/60
Domestic Patent References:
WO2013024873A1 | 2013-02-21 | |||
WO2012091061A1 | 2012-07-05 |
Foreign References:
JP2014043574A | 2014-03-13 | |||
JP2015149130A | 2015-08-20 | |||
JP2016136503A | 2016-07-28 | |||
JP2011192651A | 2011-09-29 | |||
JP2009170898A | 2009-07-30 | |||
JP2010123418A | 2010-06-03 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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