Title:
ADHESIVE FILM AND DICING DIE-BONDING INTEGRAL FILM
Document Type and Number:
WIPO Patent Application WO/2017/213248
Kind Code:
A1
Abstract:
The present disclosure relates to a thermosetting adhesive film. This adhesive film comprises (a) a polymer, (b) an epoxy resin that is in liquid form at 50°C, (c) a curing agent and/or a curing accelerator, and (d) a filler having a thermal conductivity of 10 W/(m·K) or higher, the adhesive film satisfying the condition expressed by the following inequality (1) and having a shearing strength of 1.5 MPa or greater after thermosetting: (ma+mb+mc)/M ≥ 0.43 … (1). (In the formula, ma represents the carbon mass forming a ring structure in the polymer (a), mb represents the carbon mass forming a ring structure in the epoxy resin (b), mc represents the carbon mass forming a ring structure in the curing agent and curing accelerator (c), and M represents the total mass of the polymer (a), the epoxy resin (b), and the curing agent and curing accelerator (c).)
Inventors:
YORI HANAKO (JP)
Application Number:
PCT/JP2017/021454
Publication Date:
December 14, 2017
Filing Date:
June 09, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J7/00; H01L21/301; C09J11/04; C09J11/06; C09J163/00; C09J171/10; C09J201/00; H01L21/52
Foreign References:
| JP2013091680A | 2013-05-16 | |||
| JP2010044998A | 2010-02-25 | |||
| JP2012207222A | 2012-10-25 | |||
| JP2015108139A | 2015-06-11 | |||
| JP2011241245A | 2011-12-01 | |||
| JP2010062338A | 2010-03-18 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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