Title:
ADHESIVE FILM AND METHOD FOR PRODUCING ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2023/171803
Kind Code:
A1
Abstract:
This adhesive film (10) comprises an adhesive layer (12) on at least one surface of a heat-resistant layer (11); the heat-resistant layer (11) essentially contains a thermoplastic resin that has an aromatic ring in a monomer unit; the heat-resistant layer (11) has a deflection temperature under load of 100°C or higher; and the adhesive layer (12) essentially contains an imine-modified polyolefin resin or a modified polyolefin resin having a carbodiimide group.
Inventors:
TAKEI KUNIHIRO (JP)
YOSHIKAWA YUIKO (JP)
TAKEYAMA SHUNSUKE (JP)
YOSHIKAWA YUIKO (JP)
TAKEYAMA SHUNSUKE (JP)
Application Number:
PCT/JP2023/009402
Publication Date:
September 14, 2023
Filing Date:
March 10, 2023
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
C09J7/30; C09J7/25; C09J123/06; C09J123/12; C09J123/36; C09J125/08
Domestic Patent References:
| WO2019150191A1 | 2019-08-08 | |||
| WO2017104731A1 | 2017-06-22 | |||
| WO2011129080A1 | 2011-10-20 | |||
| WO2022265039A1 | 2022-12-22 |
Foreign References:
| JP2019171662A | 2019-10-10 | |||
| JP2009043601A | 2009-02-26 | |||
| JP2022175137A | 2022-11-25 | |||
| JP2022191689A | 2022-12-28 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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