Title:
ADHESIVE FILM FOR SEMICONDUCTOR CHIP WITH THROUGH ELECTRODE
Document Type and Number:
WIPO Patent Application WO/2015/163080
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive film for a semiconductor chip with through electrodes, which is used in order to layer a plurality of semiconductor chips with through electrodes on a semiconductor wafer and which can favorably connect the through electrodes while suppressing voids and which can suppress the length of burrs projecting from the area around the semiconductor chips. The present invention is an adhesive film for a semiconductor chip with through electrodes, which is used in order to layer a plurality of semiconductor chips with through electrodes on a semiconductor wafer, wherein the minimum melt viscosity is 50-2500 Pa∙S and the thixotropic index at 140°C is 8 or less.
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Inventors:
NAGATA MAI (JP)
TAKEDA KOHEI (JP)
ENAMI TOSHIO (JP)
TAKEDA KOHEI (JP)
ENAMI TOSHIO (JP)
Application Number:
PCT/JP2015/059176
Publication Date:
October 29, 2015
Filing Date:
March 25, 2015
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01L25/065; C09J7/10; H01L21/52; H01L25/07; H01L25/18
Domestic Patent References:
| WO2009054255A1 | 2009-04-30 |
Foreign References:
| JP2009149727A | 2009-07-09 | |||
| JPH11121538A | 1999-04-30 | |||
| JP2013219286A | 2013-10-24 | |||
| JP2011202177A | 2011-10-13 | |||
| JP2007051184A | 2007-03-01 | |||
| JP2013140895A | 2013-07-18 |
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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