Title:
ADHESIVE LAMINATED FILM AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/097036
Kind Code:
A1
Abstract:
This adhesive laminated film (50) has a heat-resistant resin layer (10), a flexible resin layer (20), and an adhesive resin layer (30), in the stated order. The peel strength P0 between the heat-resistant resin layer (10) and the flexible resin layer (20) measured by the following method in accordance with JIS Z0237 is from 0.01 N/25 mm to 2.0 N/25 mm, and the peel strength P1 between the heat-resistant resin layer (10) and the flexible resin layer (20) after the adhesive laminated film (50) has been heat treated for four hours at 160°C is from 0.05 N/25 mm to 1.5 N/25 mm. (Method for measuring peel strength) The adhesive laminated film (50) is affixed to a silicon wafer so that the adhesive resin layer (30) is in contact with the silicon wafer. Next, the heat-resistant resin layer (10) is peeled from the flexible resin layer (20) in a 180° direction at a tensile speed of 300 mm/min at 25°C using a tensile tester. The strength (N/25 mm) at that time is measured twice, and the average value is taken as the peel strength.
Inventors:
HAYASHISHITA EIJI (JP)
Application Number:
PCT/JP2017/041331
Publication Date:
May 31, 2018
Filing Date:
November 16, 2017
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
B32B27/00; C09J133/06; H01L21/301
Foreign References:
| JP2013227435A | 2013-11-07 | |||
| JP2012062405A | 2012-03-29 | |||
| JP2006335787A | 2006-12-14 | |||
| JPH11199840A | 1999-07-27 | |||
| JPH10163281A | 1998-06-19 | |||
| JP2016229118A | 2016-11-25 |
Other References:
See also references of EP 3546540A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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