Title:
ADHESIVE PARTICLES, ADHESIVE AND LIGHT-MODULATING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/131318
Kind Code:
A1
Abstract:
Provided are adhesive particles for which adhesion is increased, aggregations are effectively suppressed, and dripping during heating is suppressed. Adhesive particles according to the present invention each include a thermosetting resin portion and a plurality of inorganic oxide particles, and the inorganic oxide particles are dispersed in the thermosetting resin or the inorganic oxide particles are attached to the surface of the thermosetting resin portion.
Inventors:
YAMADA YASUYUKI (JP)
WAKIYA TAKESHI (JP)
KOBAYASHI HIROSHI (JP)
WAKIYA TAKESHI (JP)
KOBAYASHI HIROSHI (JP)
Application Number:
PCT/JP2021/046439
Publication Date:
June 23, 2022
Filing Date:
December 16, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B32B27/38; C09J11/04; C09J11/08; C09J163/00; C09J201/00; G02F1/1333
Domestic Patent References:
| WO2018016378A1 | 2018-01-25 |
Foreign References:
| JPH117027A | 1999-01-12 | |||
| JPH0990369A | 1997-04-04 | |||
| JPS63191877A | 1988-08-09 | |||
| JPH0347877A | 1991-02-28 | |||
| JPH01197721A | 1989-08-09 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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