Title:
ADHESIVE PARTICLES, ADHESIVE AND LIGHT-MODULATING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/131319
Kind Code:
A1
Abstract:
Provided are adhesive particles for which dripping during heating is suppressed, adhesion is increased, and the occurrence of light leakage is suppressed. Adhesive particles according to the present invention each comprise a base particle and a covering portion disposed on the surface of the base particle; the base particle is a black particle; and the covering portion contains a thermosetting resin.
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Inventors:
YAMADA YASUYUKI (JP)
WAKIYA TAKESHI (JP)
KOBAYASHI HIROSHI (JP)
WAKIYA TAKESHI (JP)
KOBAYASHI HIROSHI (JP)
Application Number:
PCT/JP2021/046441
Publication Date:
June 23, 2022
Filing Date:
December 16, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B32B27/38; C09J11/06; C09J163/00; C09J201/00; G02F1/1333
Domestic Patent References:
| WO2018016378A1 | 2018-01-25 |
Foreign References:
| JPH1054990A | 1998-02-24 | |||
| JPH01197721A | 1989-08-09 | |||
| JPH08278506A | 1996-10-22 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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