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Title:
ADHESIVE SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/131888
Kind Code:
A1
Abstract:
An adhesive sheet (10) for processing an electronic component has a base material (11) and an adhesive layer (12), and the adhesive layer (12) contains a cured material formed by curing an energy ray curable component.

Inventors:
TAKANO KEN (JP)
KARASAWA YASUNORI (JP)
Application Number:
PCT/JP2018/048170
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/56; C09J7/20; C09J7/38; C09J133/04; C09J201/02; H01L21/52
Foreign References:
JP2013040276A2013-02-28
JP2012046763A2012-03-08
JP2017082104A2017-05-18
JP2014043543A2014-03-13
JP2016190939A2016-11-10
JP2015010198A2015-01-19
JP2017002119A2017-01-05
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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