Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2019/131887
Kind Code:
A1
Abstract:
The present invention is a polishing pad which comprises a polyurethane resin foam, and which has a polishing surface that is configured of the surface of the polyurethane resin foam. This polishing pad is configured such that the polyurethane resin foam has a tanδ of 0.24-0.60 at 25°C.
Inventors:
SHIMIZU SHINJI (JP)
MORIOKA YOSHITAKA (JP)
YAMASAKI HITOMI (JP)
USUTANI MIYUKI (JP)
MORIOKA YOSHITAKA (JP)
YAMASAKI HITOMI (JP)
USUTANI MIYUKI (JP)
Application Number:
PCT/JP2018/048165
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
NITTA HAAS INC (JP)
International Classes:
B24B37/24; C08G18/00; C08G18/48; H01L21/304; C08G101/00
Domestic Patent References:
| WO2017066077A1 | 2017-04-20 |
Foreign References:
| JP2010082708A | 2010-04-15 | |||
| JP2005120253A | 2005-05-12 | |||
| JP2012223835A | 2012-11-15 | |||
| US6764574B1 | 2004-07-20 | |||
| JP2016196058A | 2016-11-24 | |||
| JP2014065119A | 2014-04-17 |
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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