Title:
ADHESIVE SHEET FOR REAR SURFACE GRINDING, SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND BASE MATERIAL SHEET
Document Type and Number:
WIPO Patent Application WO/2022/249888
Kind Code:
A1
Abstract:
Provided is an adhesive sheet for rear surface grinding with which an adhesive layer is prevented from peeling off and a wafer can be easily peeled off from the adhesive sheet. According to the present invention, this adhesive sheet for rear surface grinding of a semiconductor wafer having a protrusion comprises a base material layer, and an adhesive layer provided on the base material layer, wherein: the adhesive layer has an opening that is smaller in diameter than the semiconductor wafer and is affixed to the outer periphery of the semiconductor wafer such that the protrusion of the semiconductor wafer is disposed inside the opening; the protrusion is protected by the base material layer in a state in which the semiconductor wafer is affixed to the adhesive layer; the base material layer includes a cushion layer and a surface treatment layer provided thereon; the adhesive layer is provided on the surface treatment layer; the surface treatment layer is formed from an acrylic resin composition containing an acrylic resin; the acrylic resin is crosslinked by photoirradiation or heating; and the adhesive layer is formed from the acrylic resin composition containing an acrylic resin.
Inventors:
MOTOIKE SHINGO (JP)
IIZUKA KAZUKI (JP)
NAKAMURA MASASHI (JP)
HASUMI MIZUKI (JP)
IIZUKA KAZUKI (JP)
NAKAMURA MASASHI (JP)
HASUMI MIZUKI (JP)
Application Number:
PCT/JP2022/019981
Publication Date:
December 01, 2022
Filing Date:
May 11, 2022
Export Citation:
Assignee:
DISCO CORP (JP)
DENKA COMPANY LTD (JP)
DENKA COMPANY LTD (JP)
International Classes:
H01L21/304; B32B27/00; C09J7/29; C09J7/38; C09J133/00; H01L21/683
Foreign References:
| JP2013211439A | 2013-10-10 | |||
| JP2018526826A | 2018-09-13 | |||
| JP2020024976A | 2020-02-13 | |||
| JP2010174067A | 2010-08-12 | |||
| JP2012216619A | 2012-11-08 | |||
| JP2019140387A | 2019-08-22 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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