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Title:
ADHESIVE SHEET FOR BACKGRINDING, SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND SUBSTRATE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/249889
Kind Code:
A1
Abstract:
Provided is an adhesive sheet for backgrinding that can increase the conformance of a substrate layer to protruding sections of a semiconductor wafer.　The present invention provides an adhesive sheet for backgrinding of a semiconductor wafer that has protruding sections, said adhesive sheet comprising a substrate layer and an adhesive agent layer that is provided on the substrate layer. The adhesive agent layer has an opening with a smaller diameter than the diameter of the semiconductor wafer, is adhered to an outer circumference section of the semiconductor wafer such that the protruding sections of the semiconductor wafer are positioned within the opening, and is configured such that, while the semiconductor wafer is adhered to the adhesive agent layer, the protruding sections are protected by the substrate layer. The substrate layer comprises a cushion layer and a barrier layer, and the oxygen permeability of the substrate layer as measured on the basis of JIS K 7162-2 (isopiestic method) at 25°C and 0% RH is 1000 ml/m2∙24h∙atm) or less.

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Inventors:
MOTOIKE SHINGO (JP)
IIZUKA KAZUKI (JP)
NAKAMURA MASASHI (JP)
HASUMI MIZUKI (JP)
Application Number:
PCT/JP2022/019982
Publication Date:
December 01, 2022
Filing Date:
May 11, 2022
Export Citation:
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Assignee:
DISCO CORP (JP)
DENKA COMPANY LTD (JP)
International Classes:
H01L21/304; B32B27/00; C09J7/29; C09J7/40; C09J201/00; H01L21/683
Foreign References:
JP2018526826A2018-09-13
JP2007238844A2007-09-20
JP2020024976A2020-02-13
JP2019140387A2019-08-22
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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