Title:
ADHESIVE SHEET, AND SEALED BODY
Document Type and Number:
WIPO Patent Application WO/2018/221571
Kind Code:
A1
Abstract:
The present invention pertains to an adhesive sheet having a thermosetting adhesive layer containing a polyfunctional epoxy compound, said adhesive sheet being characterized by having a specific shear characteristic and the content of the polyfunctional epoxy compound being 5 to 50 mass% relative to the total amount of the adhesive layer. According to the present invention, there is provided an adhesive sheet having adhesive layer with exceptional sealing properties, and a sealed body formed by sealing an object to be sealed using the sealing sheet.
Inventors:
HASEGAWA TATSUKI (JP)
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2018/020731
Publication Date:
December 06, 2018
Filing Date:
May 30, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/00; C09J11/06; C09J123/26; C09J163/00; G09F9/30; H01L27/32; H01L51/50; H05B33/04
Domestic Patent References:
| WO2014084350A1 | 2014-06-05 | |||
| WO2016158770A1 | 2016-10-06 | |||
| WO2017094590A1 | 2017-06-08 | |||
| WO2017094591A1 | 2017-06-08 | |||
| WO2018047868A1 | 2018-03-15 | |||
| WO2018047920A1 | 2018-03-15 | |||
| WO2018092800A1 | 2018-05-24 |
Foreign References:
| JP2008163344A | 2008-07-17 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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