Title:
ADHESIVE SHEET FOR SEMICONDUCTOR ELEMENT FABRICATION
Document Type and Number:
WIPO Patent Application WO/2022/270008
Kind Code:
A1
Abstract:
Provided is an adhesive sheet for semiconductor element fabrication that can protect a semiconductor element from electrostatic destruction due to peeling electrification and frictional electrification even when the semiconductor element is placed in a high-humidity environment and/or subjected to a high voltage. This adhesive sheet for semiconductor element fabrication includes an adhesive layer and a substrate. The surface resistivity ρsBM of the substrate and the surface resistivity ρsPA of the adhesive layer are 1.0 × 1013 Ω/□ or less. In one embodiment, the surface resistivity ρs10VBM of the substrate when subjected to 10 V, the surface resistivity ρs10VPA of the adhesive layer when subjected to 10 V, the surface resistivity ρs1000VBM of the substrate when subjected to 1000 V, and the surface resistivity ρs1000VPA of the adhesive layer when subjected to 1000 V satisfy formula (1) and formula (2). (1) ρs1000VBM / ρs10VBM ≤ 1000 (2) ρs1000VPA / ρs10VPA ≤ 1000
Inventors:
AKIYAMA JUN (JP)
YOSHIDA KEITA (JP)
YOSHIDA KEITA (JP)
Application Number:
PCT/JP2022/007278
Publication Date:
December 29, 2022
Filing Date:
February 22, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/00; C09J7/29; C09J7/38; H01L21/301; H01L21/304
Domestic Patent References:
| WO2008142937A1 | 2008-11-27 |
Foreign References:
| JP2016065209A | 2016-04-28 | |||
| JP2016216714A | 2016-12-22 | |||
| JP2017145309A | 2017-08-24 | |||
| JP2011210944A | 2011-10-20 | |||
| JP2019196003A | 2019-11-14 | |||
| JP2015051621A | 2015-03-19 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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