Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/124856
Kind Code:
A1
Abstract:
Provided is an adhesive sheet which allows small electronic components (for instance, chips 100 μm2 or smaller in size) to be temporarily fixed thereto satisfactorily and detached therefrom satisfactorily. The invention provides an adhesive sheet comprising a gas generation layer and a gas barrier layer disposed on at least one side of the gas generation layer, wherein the gas barrier layer deforms when laser light is irradiated on the adhesive sheet, the thickness (μm) of a high-elasticity part of the gas barrier layer is less than or equal to the value calculated from formula (1), and the thickness (μm) of the high-elasticity part of the gas barrier layer is greater than or equal to the value calculated from formula (2).
12,546 × EXP(-0.728 × log10 (Er × 106)) ··· (1)
18,096 × EXP(-0.949 × log10 (Er × 106)) ··· (2)
Er represents the modulus of elasticity (MPa) of the high-elasticity part of the gas barrier layer at 25°C according to the nano-indentation method.
Inventors:
UENO SHUSAKU (JP)
HIRAYAMA TAKAMASA (JP)
HIRAYAMA TAKAMASA (JP)
Application Number:
PCT/JP2020/044513
Publication Date:
June 24, 2021
Filing Date:
November 30, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/00; B32B27/18; B32B27/30; C09J5/00; C09J7/29; C09J7/38; C09J201/00; H01L21/301
Foreign References:
| JP2003342540A | 2003-12-03 | |||
| JP2010202833A | 2010-09-16 | |||
| JP2019070104A | 2019-05-09 | |||
| JP2010129699A | 2010-06-10 | |||
| JP2018141086A | 2018-09-13 | |||
| JP2018182276A | 2018-11-15 | |||
| JP2003292916A | 2003-10-15 | |||
| JP4151850B2 | 2008-09-17 |
Other References:
KIYOMI KATO: "UV Curing System", 1989, SOGO GIJUTSU CENTER
"Photocuring Technology", 2000, TECHNICAL INFORMATION INSTITUTE CO., LTD.
"Photocuring Technology", 2000, TECHNICAL INFORMATION INSTITUTE CO., LTD.
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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