Title:
THERMOPLASTIC ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/124857
Kind Code:
A1
Abstract:
The present invention addresses the problem of bonding a resin that is difficult to be bonded. As a means for solving the problem, the present invention provides a thermoplastic adhesive composition that contains the components (A) to (C) described below. (A) a modified polyolefin resin having a functional group
(B) a metal alkoxide and/or a metal chelate
(C) a thermoplastic elastomer resin
Inventors:
KODAMA HIROTO (JP)
Application Number:
PCT/JP2020/044541
Publication Date:
June 24, 2021
Filing Date:
November 30, 2020
Export Citation:
Assignee:
AICELLO CORP (JP)
International Classes:
C09J11/06; C09J7/10; C09J7/35; C09J123/26; C09J201/00
Foreign References:
| JP2017165865A | 2017-09-21 | |||
| JP2017101145A | 2017-06-08 | |||
| JP2008195943A | 2008-08-28 | |||
| JP2017137471A | 2017-08-10 | |||
| JP2017031301A | 2017-02-09 |
Attorney, Agent or Firm:
YAMADA, Yasuyuki et al. (JP)
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