Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/123931
Kind Code:
A1
Abstract:
The present invention provides an adhesive sheet which exhibits adequate adhesiveness to a semiconductor chip and a sealing resin that seals the semiconductor chip, and which is not likely to leave adhesive residue when removed, while being able to be easily removed from the sealing resin. An adhesive sheet according to the present invention is provided with a base material and an adhesive layer that is arranged on at least one side of the base material; the adhesive layer contains an acrylic adhesive; and the acrylic adhesive contains a base polymer that has an acid value of 16 mgKOH/g or less. According to one embodiment of the present invention, the adhesive sheet is provided with the base material, the adhesive layer that is arranged on one side of the base material, and a second adhesive layer that is arranged on the reverse side of the base material from the adhesive layer.
Inventors:
KATO KAZUMICHI (JP)
YUTOU TAKUMI (JP)
NAKAO KOTA (JP)
YUTOU TAKUMI (JP)
NAKAO KOTA (JP)
Application Number:
PCT/JP2021/039064
Publication Date:
June 16, 2022
Filing Date:
October 22, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J133/00; C09J7/38; C09J163/00; H01L21/56
Domestic Patent References:
| WO2019188546A1 | 2019-10-03 |
Foreign References:
| JP2015168711A | 2015-09-28 | |||
| JP2012015432A | 2012-01-19 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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