Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/123932
Kind Code:
A1
Abstract:
Provided is an adhesive sheet which has an appropriate adhesiveness to a sealing resin that seals a semiconductor chip and to the semiconductor chip, and can be easily peeled off from the sealing resin, and in which it is difficult for adhesive residue to occur during peeling, and after peeling off the adhesive sheet, it is difficult to create a height difference between the semiconductor chip and the sealing resin. The adhesive sheet of the present invention comprises: a base material; and an adhesive layer disposed on at least one side of the base material, wherein the adhesive layer contains an acrylic adhesive, the amount of subduction of the adhesive sheet in an environment of 23°C using TMA is 5 μm or less, and the T2 relaxation time (T2s) of an S component of the adhesive layer by pulse NMR is 45 μsec or less.
Inventors:
YUTOU TAKUMI (JP)
KATO KAZUMICHI (JP)
NAKAO KOTA (JP)
KATO KAZUMICHI (JP)
NAKAO KOTA (JP)
Application Number:
PCT/JP2021/039065
Publication Date:
June 16, 2022
Filing Date:
October 22, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J133/00; C09J7/38; H01L21/56
Foreign References:
| JP2019199561A | 2019-11-21 | |||
| JP2012149182A | 2012-08-09 | |||
| JP2014198830A | 2014-10-23 | |||
| JP2015168711A | 2015-09-28 | |||
| JP2011124495A | 2011-06-23 | |||
| JP2012064714A | 2012-03-29 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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