ADHESIVE STRUCTURE - MITSUBISHI MATERIALS CORP

Title:

ADHESIVE STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2023/153060

Kind Code:

A1

Abstract:

This adhesive structure (10, 20) comprises: a base body (11, 21); and a protrusion section (12, 22) having a plurality of protrusions (13, 23) provided on the surface of at least a portion of the base body (11, 21). The adhesive structure is made of an inorganic material. The plurality of protrusions (13, 23) are arranged in a periodic fashion along a first direction and a second direction that is perpendicular to the first direction. The protrusions (13, 23) have a sharp section (14, 24) having a sharp tip. The average pitch between the protrusions (13, 23) along the first direction is within a range of 100 nm to 1500 nm. The average pitch of the protrusions (13, 23) along the second direction is within a range of 100 nm to 1500 nm. The average height of the protrusions (13, 23) is within a range of 100 nm to 2000 nm.

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Inventors:

MAENO YOHEI (JP)

Application Number:

PCT/JP2022/044331

Publication Date:

August 17, 2023

Filing Date:

December 01, 2022

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

B82B1/00; F16B11/00; F16B47/00

Domestic Patent References:

WO2007017458A1	2007-02-15
WO2007032164A1	2007-03-22

Foreign References:

JP2009090423A	2009-04-30
US20110016675A1	2011-01-27
US20110271497A1	2011-11-10
JP2003025431A	2003-01-29

Attorney, Agent or Firm:

MATSUNUMA Yasushi et al. (JP)

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