Title:
ADHESIVE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/153061
Kind Code:
A1
Abstract:
An adhesive structure (1) that is provided with a substrate (2) and triangular wave-shaped protrusions (3) provided to the surface of at least a portion of the substrate (2), and that comprises an inorganic material, wherein the average pitch of the triangular wave-shaped protrusions (3) is in the range of 100 nm to 1000 nm, and the average height of the triangular wave-shaped protrusions (3) is in the range of 100 nm to 1000 nm.
Inventors:
MAENO YOHEI (JP)
Application Number:
PCT/JP2022/044390
Publication Date:
August 17, 2023
Filing Date:
December 01, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C09J5/00; F16B11/00
Foreign References:
| JP2013082056A | 2013-05-09 | |||
| JP2013118378A | 2013-06-13 | |||
| JP2020503483A | 2020-01-30 | |||
| JP2007083317A | 2007-04-05 | |||
| JP2000511583A | 2000-09-05 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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