Title:
ADHESIVE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/153062
Kind Code:
A1
Abstract:
An adhesive structure in which at least a portion of the surface thereof comprises an inorganic material, the elastic modulus of the surface is in the range of 0.01 GPa to 50 GPa, and the adhesive force, when a nanoindenter is used to press a spherical indenter having a diameter of 40 μm into the surface under the condition of a pressing depth of at least either 10 nm or 20 nm, is 35 N/cm2 or higher.
Inventors:
MAENO YOHEI (JP)
Application Number:
PCT/JP2022/044413
Publication Date:
August 17, 2023
Filing Date:
December 01, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C09J5/00; F16B11/00
Domestic Patent References:
| WO2007032164A1 | 2007-03-22 |
Foreign References:
| JP2010229506A | 2010-10-14 | |||
| JP2009090423A | 2009-04-30 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
Download PDF:
Previous Patent: ADHESIVE STRUCTURE
Next Patent: INSULATED ELECTRICAL WIRE AND METHOD FOR MANUFACTURING INSULATED ELECTRICAL WIRE
Next Patent: INSULATED ELECTRICAL WIRE AND METHOD FOR MANUFACTURING INSULATED ELECTRICAL WIRE