Title:
ADHESIVE TAPE FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/068277
Kind Code:
A1
Abstract:
An adhesive tape for circuit connection provided with a first base material, an adhesive film, and a second base material, in that order, the adhesive film containing a cationic polymerizable compound, a thermal cationic polymerization initiator, and a thermoplastic resin and the cationic polymerizable compound containing dicyclopentadiene dimethanol diglycidyl ether. A connection structure provided with a first circuit member that has a first electrode, a second circuit member that has a second electrode, and a connection section that is positioned between the first circuit member and the second circuit member and electrically connects the first electrode and the second electrode to one another, the connection section including a cured product of the adhesive film in the adhesive tape for circuit connection.
Inventors:
MORIYA TOSHIMITSU (JP)
ICHIMURA TAKAYUKI (JP)
IWAI AKIKO (JP)
KOBAYASHI RYOHTA (JP)
ICHIMURA TAKAYUKI (JP)
IWAI AKIKO (JP)
KOBAYASHI RYOHTA (JP)
Application Number:
PCT/JP2022/038795
Publication Date:
April 27, 2023
Filing Date:
October 18, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J9/02; C09J7/30; C09J7/35; C09J11/08; C09J163/00; C09J201/00; H05K3/32; H05K3/36
Foreign References:
| JP2016125043A | 2016-07-11 | |||
| JP2017152354A | 2017-08-31 | |||
| JP2008179682A | 2008-08-07 | |||
| JP2012171980A | 2012-09-10 | |||
| JP2017214472A | 2017-12-07 | |||
| JP2016174126A | 2016-09-29 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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