Title:
ADHESIVE TAPE FOR DICING, AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2021/124725
Kind Code:
A1
Abstract:
An adhesive tape for dicing comprising a base material and an adhesive layer. The adhesive layer is formed from an adhesive composition containing a silicone resin in which a silicone gum (G) and a silicone resin (R) are mixed, an organopolysiloxane that has at least two or more silicon-atom-bonded hydrogen atoms per molecule and serves as a crosslinking agent, and a photosensitive platinum (Pt) catalyst. The mixture ratio of the silicone gum (G) and silicone resin (R) is within the range from 35.0/65.0 to 50.0/50.0. The silicone gum (G) includes a silicone gum (Galk) formed from an organopolysiloxane containing silicon-atom-bonded alkenyl groups, and the silicon-atom-bonded alkenyl group content is within the range from 1.8×10-6 mol/g to 1.0×10-5 mol/g (inclusive).
Inventors:
MASUDA AKIYOSHI (JP)
SHIMODA TAKAYUKI (JP)
SAKAI TAKAHIRO (JP)
SHIMODA TAKAYUKI (JP)
SAKAI TAKAHIRO (JP)
Application Number:
PCT/JP2020/041707
Publication Date:
June 24, 2021
Filing Date:
November 09, 2020
Export Citation:
Assignee:
MAXELL HOLDINGS LTD (JP)
International Classes:
C09J11/06; C09J7/24; C09J7/25; C09J7/38; C09J183/05; C09J183/07; H01L21/301
Domestic Patent References:
| WO2019049950A1 | 2019-03-14 | |||
| WO2018056298A1 | 2018-03-29 | |||
| WO2020050167A1 | 2020-03-12 |
Foreign References:
| JP2007150065A | 2007-06-14 | |||
| JP2016122812A | 2016-07-07 |
Attorney, Agent or Firm:
FURUBE, Jiro (JP)
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