Title:
ADHESIVE TAPE FOR DICING AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2021/124724
Kind Code:
A1
Abstract:
This adhesive tape for dicing comprises a base material and an adhesive layer. The adhesive layer comprises an adhesive composition containing: a silicone-based resin in which a silicone gum (G) and a silicone resin (R) are mixed; an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule as a crosslinking agent; a peroxide as a thermal polymerization initiator; and a photosensitive platinum (Pt) catalyst. The mixing ratio of the silicone gum (G) and the silicone resin (R) falls within the range of 40.0/60.0 to 56.0/44.0. The silicone gum (G) includes a silicone gum (Galk) comprising an organopolysiloxane containing a silicon atom-bonded alkenyl group, with the content of silicon atom-bonded alkenyl groups falling within the range of 7.0×10-7 to 5.5×10-6 mol/g.
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Inventors:
MASUDA AKIYOSHI (JP)
SHIMODA TAKAYUKI (JP)
SAKAI TAKAHIRO (JP)
SHIMODA TAKAYUKI (JP)
SAKAI TAKAHIRO (JP)
Application Number:
PCT/JP2020/041705
Publication Date:
June 24, 2021
Filing Date:
November 09, 2020
Export Citation:
Assignee:
MAXELL HOLDINGS LTD (JP)
International Classes:
C09J7/38; C09J11/04; C09J11/06; C09J183/04; H01L21/301
Domestic Patent References:
| WO2019049950A1 | 2019-03-14 | |||
| WO2018056298A1 | 2018-03-29 | |||
| WO2020050167A1 | 2020-03-12 |
Foreign References:
| JP2007150065A | 2007-06-14 | |||
| JP2016122812A | 2016-07-07 |
Attorney, Agent or Firm:
FURUBE, Jiro (JP)
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