ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME

WIPO Patent Application WO/2008/054012

A1

In a chip-on-chip type semiconductor device, an adhesive tape electrically connects between a semiconductor chip (10) and a semiconductor chip (20). The adhesive tape contains; (A) a film forming resin of 10-50 wt%, (B) a thermosetting resin of 30-80 wt%, and (C) a curing agent of 1-20 wt% having flux activation characteristics.

KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
HIRANO TAKASHI (JP)

PCT/JP2007/071454

May 08, 2008

October 30, 2007

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SUMITOMO BAKELITE CO (JP)
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
HIRANO TAKASHI (JP)

H01L25/065; C09J7/00; C09J133/00; C09J163/00; C09J171/10; C09J179/08; H01L25/07; H01L25/18

JP2004244486A	2004-09-02
JP2003264205A	2003-09-19
JP2006143795A	2006-06-08
JP2004174574A	2004-06-24
JP2005044989A	2005-02-17
JP2003231876A	2003-08-19
JP2004296917A	2004-10-21
JPS61276873A	1986-12-06
JP3769688B2	2006-04-26
JP2004063753A	2004-02-26
JP2001127243A	2001-05-11
JP2002026241A	2002-01-25

See also references of EP 2096671A4
EIJI HAGIMOTO: "CSP-gijutsu No Subete Part 2 (All about CSP Technique Part 2)", KOGYO CHOSAKAI PUBLISHING, INC., pages: 62 - 72
TAKASHI AKAZAWA: "SiP-gijutsu No Subete (All about SiP Technique)", KOGYO CHOSAKAI PUBLISHING, pages: 176 - 188

KOBAYASHI, Hiroshi et al. (IKUBO & KATAYAMAFukuoka Bldg. 9th Fl.,8-7, Yaesu 2-chom, Chuo-ku Tokyo 28, JP)

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