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Title:
SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/054011
Kind Code:
A1
Abstract:
A chip-on-chip type semiconductor electronic component which meets requirement of further density increase of semiconductor integrated circuits is provided. A semiconductor device is also provided. In the chip-on-chip type semiconductor electronic component, the circuit surface of a first semiconductor chip and the circuit surface of a second semiconductor chip are arranged to face each other. A distance (X) between the first semiconductor chip and the second semiconductor chip is 50μm or less, and the shortest distance (Y) between the side surface of the second semiconductor chip and a first external electrode is 1mm or less. The semiconductor device using such semiconductor electronic component is also provided.

Inventors:
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
HIRANO TAKASHI (JP)
Application Number:
PCT/JP2007/071453
Publication Date:
May 08, 2008
Filing Date:
October 30, 2007
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
HIRANO TAKASHI (JP)
International Classes:
H01L25/065; C09J7/00; C09J11/06; C09J133/00; C09J163/00; C09J171/10; C09J179/08; H01L25/07; H01L25/18
Foreign References:
JP2003264205A2003-09-19
JP2004244486A2004-09-02
JP2004174574A2004-06-24
JP2006060067A2006-03-02
JP2005044989A2005-02-17
JP2003231876A2003-08-19
JP2004296917A2004-10-21
JPS61276873A1986-12-06
JP3769688B22006-04-26
JP2004063753A2004-02-26
JP2001127243A2001-05-11
JP2002026241A2002-01-25
Other References:
See also references of EP 2079108A4
EIJI HAGIMOTO: "CSP-gijutsu No Subete Part 2 (All about CSP Technique Part 2)", KOGYO CHOSAKAI PUBLISHING, INC., pages: 62 - 72
TAKASHI AKAZAWA: "SiP-gijutsu No Subete (All about SiP Technique)", KOGYO CHOSAKAI PUBLISHING, pages: 176 - 188
Attorney, Agent or Firm:
KOBAYASHI, Hiroshi et al. (IKUBO & KATAYAMA Fukuoka Bldg. 9th Fl.,8-7, Yaesu 2-chome, Chuo-k, Tokyo 28, JP)
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