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Title:
AGENT FOR INCREASING SELECTION RATIO OF POLISHING RATES
Document Type and Number:
WIPO Patent Application WO2004078410
Kind Code:
A3
Abstract:
An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wherein the agent is provided as a component of a polishing composition used together with a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin; a polishing composition which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wherein the polishing composition comprises the above agent, and wherein the polishing composition is used together with a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin; and a process for increasing a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, comprising the step of applying the polishing composition to a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin.

Inventors:
HAGIHARA TOSHIYA (JP)
WADA YUTAKA (JP)
AKATSUKA TOMOHIKO (JP)
SASAKI TATSUYA (JP)
Application Number:
PCT/JP2004/002680
Publication Date:
November 04, 2004
Filing Date:
March 03, 2004
Export Citation:
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Assignee:
KAO CORP (JP)
EBARA CORP (JP)
HAGIHARA TOSHIYA (JP)
WADA YUTAKA (JP)
AKATSUKA TOMOHIKO (JP)
SASAKI TATSUYA (JP)
International Classes:
B24B7/22; B24B37/00; B24B57/00; C09G1/00; C09K3/14; H01L21/304; H01L21/3105; (IPC1-7): H01L21/3105
Domestic Patent References:
WO2001012740A12001-02-22
WO2001004231A12001-01-18
Foreign References:
US20020173221A12002-11-21
US6358850B12002-03-19
EP1106663A12001-06-13
US20020081949A12002-06-27
EP1077241A22001-02-21
EP1050369A22000-11-08
US5958794A1999-09-28
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