Title:
AGENT FOR INCREASING SELECTION RATIO OF POLISHING RATES
Document Type and Number:
WIPO Patent Application WO2004078410
Kind Code:
A3
Abstract:
An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wherein the agent is provided as a component of a polishing composition used together with a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin; a polishing composition which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wherein the polishing composition comprises the above agent, and wherein the polishing composition is used together with a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin; and a process for increasing a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, comprising the step of applying the polishing composition to a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin.
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Inventors:
HAGIHARA TOSHIYA (JP)
WADA YUTAKA (JP)
AKATSUKA TOMOHIKO (JP)
SASAKI TATSUYA (JP)
WADA YUTAKA (JP)
AKATSUKA TOMOHIKO (JP)
SASAKI TATSUYA (JP)
Application Number:
PCT/JP2004/002680
Publication Date:
November 04, 2004
Filing Date:
March 03, 2004
Export Citation:
Assignee:
KAO CORP (JP)
EBARA CORP (JP)
HAGIHARA TOSHIYA (JP)
WADA YUTAKA (JP)
AKATSUKA TOMOHIKO (JP)
SASAKI TATSUYA (JP)
EBARA CORP (JP)
HAGIHARA TOSHIYA (JP)
WADA YUTAKA (JP)
AKATSUKA TOMOHIKO (JP)
SASAKI TATSUYA (JP)
International Classes:
B24B7/22; B24B37/00; B24B57/00; C09G1/00; C09K3/14; H01L21/304; H01L21/3105; (IPC1-7): H01L21/3105
Domestic Patent References:
WO2001012740A1 | 2001-02-22 | |||
WO2001004231A1 | 2001-01-18 |
Foreign References:
US20020173221A1 | 2002-11-21 | |||
US6358850B1 | 2002-03-19 | |||
EP1106663A1 | 2001-06-13 | |||
US20020081949A1 | 2002-06-27 | |||
EP1077241A2 | 2001-02-21 | |||
EP1050369A2 | 2000-11-08 | |||
US5958794A | 1999-09-28 |
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