Title:
AGENT FOR PROTECTIVE COATING FILM FOR MOLD AND METHOD FOR FORMING PROTECTIVE COATING FILM FOR MOLD
Document Type and Number:
WIPO Patent Application WO/2005/080062
Kind Code:
A1
Abstract:
An agent (M) for a protective coating film for a mold which is applied on the region of the outer surface of a mold (9) except the portion for a cavity (10), which comprises a mixed fluid containing a urethane, methyl ethyl ketone and ethyl acetate and an agent for enhancing a curing rate comprising a mixture of an isocyanate-based compound and ethyl acetate; and a method for forming a protective coating film using the agent. The agent (M) for a protective coating film covers the mold (9) in such a state that it adheres to the outer surface of the mold and is not easily released from it and can protect the mold, as a protective film (11), against rust, damage and the like during its storage. The protective film (11) exhibits heat resistance at about 100°C and thus can satisfactorily endure the use at 70 to 80°C during stamping.
Inventors:
AMANO SHIGEHISA (JP)
Application Number:
PCT/JP2004/002031
Publication Date:
September 01, 2005
Filing Date:
February 20, 2004
Export Citation:
Assignee:
AMANO SHIGEHISA (JP)
International Classes:
C23C26/00; C23C30/00; (IPC1-7): B29C33/70; B22C3/00; C23C26/00
Foreign References:
| JPH07163940A | 1995-06-27 | |||
| JP2000289036A | 2000-10-17 | |||
| JPH0780403A | 1995-03-28 | |||
| JP2002035686A | 2002-02-05 |
Attorney, Agent or Firm:
Ishiguro, Kenji (Kamiyashiro 1-chome Meito-ku, Nagoya-sh, Aichi 25, JP)
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