Title:
ALKALI-SOLUBLE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, AND CURED OBJECT THEREFROM
Document Type and Number:
WIPO Patent Application WO/2023/120355
Kind Code:
A1
Abstract:
Provided are: an alkali-soluble resin which, even under low-temperature curing conditions, can give cured objects having excellent solvent resistance and which is suitable for use in various applications including color filters; and a photosensitive resin composition. This alkali-soluble resin has an acid group and a polymerizable unsaturated double bond and has an epoxy equivalent of 5,000 g/eq. or less. The alkali-soluble resin comprises a constituent unit represented by formula (1), a constituent unit represented by formula (2), and a constituent unit represented by formula (3). In the formulae, A represents a benzene ring or a naphthalene ring; R1, R3, and R5 each represent a C1-C20 divalent hydrocarbon group; R2, R4, and R6 each represent a substituent bonded to the A and the substituent is a hydroxyl group or a C1-C20 organic group; a indicates the number of R2 moieties and is an integer of 0-5, b indicates the number of R4 moieties and is an integer of 0-5, and c indicates the number of R6 moieties and is an integer of 0-5; when there are two or more R2, R4, or R6 moieties, they may be the same or different; X and Y each represent an organic group; and Z represents a divalent organic group.
Inventors:
TERADA TAKUMA (JP)
OTSUKI NOBUAKI (JP)
OTSUKI NOBUAKI (JP)
Application Number:
PCT/JP2022/046165
Publication Date:
June 29, 2023
Filing Date:
December 15, 2022
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND (JP)
International Classes:
C08G59/14; G03F7/027; G03F7/032
Domestic Patent References:
| WO2021039799A1 | 2021-03-04 |
Foreign References:
| JP2006071880A | 2006-03-16 | |||
| JP2017068242A | 2017-04-06 | |||
| JP2020186325A | 2020-11-19 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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