Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION AND ADHESIVE COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2023/120356
Kind Code:
A1
Abstract:
[Problem] To provide a curable organopolysiloxane composition that has high initial adhesive strength in a step such as temporary fixation and can be detached easily from a base material in a subsequent step, and a method for using the curable organopolysiloxane composition. [Solution] A curable organopolysiloxane composition containing: (A) an organosiloxane component including a specific silicon-atom-binding functional group that contains a (meth)acrylic group (RA), a resinous organosiloxane structural factor containing an alkenyl group, and a linear organopolysiloxane structural factor; (B) a siloxane component free of carbon-carbon multiple bonds in each molecule; and (C) a photoradical polymerization initiator. Additionally, the use of the curable organopolysiloxane composition.
Inventors:
YOKOUCHI YUKI (JP)
IIMURA TOMOHIRO (JP)
IIMURA TOMOHIRO (JP)
Application Number:
PCT/JP2022/046170
Publication Date:
June 29, 2023
Filing Date:
December 15, 2022
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C09J183/06; C09J7/38; C09J183/07
Domestic Patent References:
| WO2018066572A1 | 2018-04-12 | |||
| WO2022234802A1 | 2022-11-10 | |||
| WO2022186138A1 | 2022-09-09 | |||
| WO2022186137A1 | 2022-09-09 |
Foreign References:
| JP2021501813A | 2021-01-21 | |||
| JP2022524781A | 2022-05-10 | |||
| JP2022501460A | 2022-01-06 |
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