ALKYL SILYL PEROXIDE, HEAT-CURABLE COMPOSITION, RESIN FILM, PREPREG, METAL LAMINATE, AND PRINTED WIRING BOARD

Title:

ALKYL SILYL PEROXIDE, HEAT-CURABLE COMPOSITION, RESIN FILM, PREPREG, METAL LAMINATE, AND PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2024/070840

Kind Code:

A1

Abstract:

An alkyl silyl peroxide which is at least one compound selected from the group consisting of compounds represented by general formula (1) and compounds represented by general formula (2). The alkyl silyl peroxide is a novel polymerization initiator usable in steps for curing heat-polymerizable compositions at high temperatures.

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Inventors:

TAKUMA KANAKO (JP)
HAYASHI MASAKI (JP)

Application Number:

PCT/JP2023/034058

Publication Date:

April 04, 2024

Filing Date:

September 20, 2023

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Assignee:

NOF CORP (JP)

International Classes:

C07F7/08; C08F4/34; C08F4/36; C08F299/02

Attorney, Agent or Firm:

UNIUS PATENT ATTORNEYS OFFICE (JP)

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