Title:
HOLLOW PARTICLES, METHOD FOR MANUFACTURING HOLLOW PARTICLES, RESIN COMPOSITION, RESIN STRUCTURE, AND METHOD FOR MANUFACTURING RESIN STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/070841
Kind Code:
A1
Abstract:
Provided are hollow particles which suppress reductions in pressure resistance under high temperatures. The present invention pertains to hollow particles comprising a shell, which includes a resin, and a hollow portion surrounded by the shell. The resin has a structure formed by polymerizing a (meth)acryloyl group and at least one type of bond selected from a urethane bond and a urea bond. The average circularity of the hollow particles is 0.90 or greater. When D50 is defined as the volume-based 50% cumulative particle diameter of the hollow particles and D90 is defined as the volume-based 90% cumulative particle diameter of the hollow particles, the ratio (D90/D50) of D90 to D50 is 1.70 or less. The breaking strength when the hollow particles are compressed under the conditions of a maximum collapse test force of 2000 mN and a loading rate of 0.0466 mN/s at 150°C and a micro-compression tester is used is 5.0 MPa or greater.
Inventors:
YAGYU SAKYO (JP)
Application Number:
PCT/JP2023/034061
Publication Date:
April 04, 2024
Filing Date:
September 20, 2023
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08F20/36; C08F2/18; C08F290/14; C08F299/06; C08L63/00
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
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