Title:
ALUMINUM BASE COPPER-CLAD LAMINATED PLATE
Document Type and Number:
WIPO Patent Application WO/2018/193757
Kind Code:
A1
Abstract:
An aluminum base copper-clad laminated plate comprises: an electrically-insulating insulating resin layer having a thickness of 60 to 140 μm; an aluminum plate laminated onto one surface of the insulating resin layer and having a thickness of 0.5 to 2.0 mm; and copper foil laminated onto the other surface of the insulating resin layer and having a thickness of 18 to 105 μm. When the aluminum base copper-clad laminated plate having a length of 100 mm and a width of 25 mm is subjected to a three-point bending test in which a load is applied from the copper foil side under the conditions of a supporting span of 64 mm and a bending rate of 10 mm/min, a 0.2% proof stress is 200 to 295 MPa.
Inventors:
KITAHARA DAISUKE (JP)
Application Number:
PCT/JP2018/009896
Publication Date:
October 25, 2018
Filing Date:
March 14, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B15/08; B32B7/02; B32B15/20; B32B27/06; B32B27/18; H05K1/05
Foreign References:
| JPH01275036A | 1989-11-02 | |||
| JP2005353974A | 2005-12-22 | |||
| JP2011100816A | 2011-05-19 | |||
| JP2017063161A | 2017-03-30 | |||
| JP2003046210A | 2003-02-14 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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