Title:
ANALYSIS DEVICE, ANALYSIS METHOD, MACHINING SYSTEM, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/067643
Kind Code:
A1
Abstract:
An analysis device according to the present disclosure analyzes the state of a machining tool. The analysis device comprises: an acquisition unit that acquires measurement results from at least one sensor fitted to a machining tool; a computation unit that performs data processing of the measurement results acquired by the acquisition unit; and an image processing unit that displays, on a display screen, a first image displaying the measurement results acquired by the acquisition unit in time-series, and a second image displaying computation results obtained as a result of the data processing performed by the computation unit. The image processing unit displays, as the second image, the computation results corresponding to the measurement results for a specific time period in the first image.
Inventors:
TOYOSHIMA AKIHIRO (JP)
Application Number:
PCT/JP2021/038357
Publication Date:
April 27, 2023
Filing Date:
October 18, 2021
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B23Q17/09; B23Q17/00
Domestic Patent References:
| WO2018235170A1 | 2018-12-27 | |||
| WO2021029404A1 | 2021-02-18 | |||
| WO2019078129A1 | 2019-04-25 |
Foreign References:
| JP2017132000A | 2017-08-03 | |||
| JP2012093983A | 2012-05-17 | |||
| US20180117725A1 | 2018-05-03 | |||
| JP2020166543A | 2020-10-08 | |||
| JP2018534680A | 2018-11-22 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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