Title:
MONITORING DEVICE, MONITORING METHOD, MACHINING SYSTEM, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/067642
Kind Code:
A1
Abstract:
A monitoring device according to the present disclosure monitors the state of a machining tool. The monitoring device comprises: an acquisition unit that acquires measurement results from at least one sensor fitted to a machining tool; memory that stores the measurement results of a prescribed time period once acquired by the acquisition unit; a computation unit that performs data processing of the measurement results stored in the memory; and an image processing unit that displays, on a display screen, a first image displaying the measurement results acquired by the acquisition unit in time-series, and a second image displaying computation results obtained as a result of the data processing performed by the computation unit.
Inventors:
TOYOSHIMA AKIHIRO (JP)
Application Number:
PCT/JP2021/038356
Publication Date:
April 27, 2023
Filing Date:
October 18, 2021
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B23Q17/09; B23Q17/00
Domestic Patent References:
| WO2021049337A1 | 2021-03-18 | |||
| WO2013073436A1 | 2013-05-23 | |||
| WO2018235170A1 | 2018-12-27 | |||
| WO2015194010A1 | 2015-12-23 |
Foreign References:
| JP2012093983A | 2012-05-17 | |||
| US20180117725A1 | 2018-05-03 | |||
| JP2015077658A | 2015-04-23 | |||
| US20140216170A1 | 2014-08-07 | |||
| JPH068106A | 1994-01-18 | |||
| US20150261207A1 | 2015-09-17 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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